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Indium 9.88-HF PoP Paste

PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process.
Manufacturer: Indium
Description

Features

• Halogen-free – no intentionally added halogens
• Eliminates defects due to package-warping
• Air-reflow
• Rheology optimized for both dipping and package-retention
• Designed for use with both SAC305 and Sn63/Pb37 alloys
• Excellent solderability
• Long pot life
• Suitable for use down to 0.4mm pitch

Introduction

PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process.

Solder Paste Properties

Variable

 

Value

Test Method

Flux Type Classification:

ROL0

J-STD-004

(IPC-TM-650: 2.3.32 and 2.3.33)

Typical Viscosity:

240kcps

ANSI/IPC-TM650

Typical Tack Strength:

61g

ANSI/IPC-TM650

SIR (ohms):

>109 after 7 days @

85°C & 85% RH)

ANSI/IPC-TM650

Shelf Life (Sealed):

6 months at ≤10°C

≤10°C

Working Life:

8 hours at room

temperature

(<30°C, <70%RH)

Internal test method

All information is for reference only. Not to be used as incoming product specifications.

Application

Solder paste is applied to the spheres in a doctor-bladed dipping process (Figure 1).
• Typical package-on-package applications only need dipping to 25-45% of the sphere height Consistent solder paste volumes are reproducibly attained from dipping 0.4mm or higher pitch packages in the PoP Paste Indium9.88-HF.
Figure 2 is an example of a PoP process where a 0.5mm pitch BGA package has been dipped in 8mil thickness (~50% of ball height) PoP Paste Indium9.88-HF.

Figure 2: Bottom View of 0.5mm Pitch BGA Package

After Dipping in PoP Paste Indium9.88-HF

Alloys

PoP Paste Indium9.88-HF is available in two alloy configurations: Tin/Lead eutectic (63Sn/37Pb) and SAC 305 (96.5Sn/ 3.0Ag/0.5Cu). The following table shows the alloy proper ties.

Indalloy

Number

Alloy Composition

Melting Point

Melting Point

 

Tensile

Young's

 

Indalloy

Number

Alloy Composition

Liquidus

Solidus

Liquidus

Solidus

Density

Strength

Modulus

Elongation

Indalloy

Number

Alloy Composition

°C

°C

°F

°F

g/cm3

psi

psi*10^6

%

106

63Sn/37Pb

183

183

361

361

8.40

7500

4.35

37

256

96.5Sn/3.0Ag/0.5Cu

220

217

428

423

7.40

7200

2.41

19.3

Cleaning

Although designed as a no-clean material, the residue from the PoP Paste Indium9.88-HF may be cleaned using appropriate cleaning solutions. Please consult with Indium Corporation Technical Service personnel for details.

Reflow

Recommended Profile:

Reflow Profiles: SAC305

250

Solidus Melting Point

Packaging

PoP Paste Indium9.88-HF is available in airless (bubble-free) packaging:

For automated dispense applications:
75g (30cc) syringes with an air-pressure piston

Other packaging may be available to meet specific requirements. Consult with Indium Corporation Sales or Technical Ser vice staf f for details.

Storage and Handling

PoP Paste Indium9.88-HF syringes and cartridges should be stored tip down at <10°C for a maximum of 6 months. Storage temperatures should not exceed 30°C for more than 4 days. PoP Paste Indium9.88-HF should be allowed to stand for at least 4 hours at room temperature before using.

Once removed from cold storage, the solder paste in a sealed syringe may remain at room temperature for up to 7 days before usage and during usage. However, once outside the syringe, its working life is estimated to be 8 hours, and may be less under high temperature (>25°C ) and humidity (>70%RH) conditions.

The paste should not be subjected to multiple cold/heat cycles or viscosity changes and/or flux separation may occur.

Technical Support

Indium Corporation sets the industry standard in providing rapid response, on-site technical support for our customers worldwide. Indium’s team of Technical Support Engineers can provide expertise in all aspects of Materials Science and Semiconductor Packaging process applications.

Peak reflow temperature will vary with the alloy type. A short preheat (140-150°C for 63Sn and 150-160°C for SAC305) for less than 45 seconds may be used to reduce solderballing caused by excess paste. The profile should ideally be a linear ramp at 1-2°C/second up to 20-30°C above solidus temperature, with a rapid cool down
after wards, and a minimum time above liquidus of 20 seconds.

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Unit 7, Orbital 25, Dwight Road, Watford, Hertfordshire
WD18 9DA

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