LOCTITE ABLESTIK ABP 8065T

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LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive.

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From £660.90 Excl VAT £793.08 incl VAT

LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive.

+ More Details

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Product Information

LOCTITE ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.

Medium to high thermal conductivity
No channel void issue
High die shear strength
High electrical conductivity

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.