- Home
- Adhesives
- Die Attach Adhesives
- LOCTITE ABLESTIK ABP 8068TD - 25G Syringe
LOCTITE ABLESTIK ABP 8068TD - 25G Syringe
Product Information
LOCTITE ABLESTIK ABP 8068TD is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. It is engineered to bond to a variety of die with or without BSM (Backside Metallization). This material’s epoxy assisted sintering formulation is designed to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages such as SiP.
- One component
- Good workability
- Good adhesion to PPF, Ag, Cu and Au
- Good adhesion to BSM Si die and Non-BSM Si die
- High thermal conductivity
- High electrical conductivity
- High reliability
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
Video
No video available.
Similar Products
You May Be Interested In
Recently Viewed
There are no recently viewed products.