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- LOCTITE ABLESTIK CDF 500
LOCTITE ABLESTIK CDF 500
Product Information
LOCTITE ABLESTIK CDF 500 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. It can be used in a variety of die sizes ranging from 3mm x 3mm to 8mm x 8mm.
Product Benefits
- High MSL reliability
- Controlled fillet size
- No resin bleed-out
- Consistent bondline thickness
- Pre-cut wafer lamination equipment compatible
- Recommended for thin wafer handling applications
- Good wetting and low warpage for large die
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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