LOCTITE ABLESTIK QMI2569

LOCTITE ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal hermetic packages.

+ More Details

From £2,342.00 Excl VAT £2,810.40 incl VAT

LOCTITE ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal hermetic packages.

+ More Details

Datasheets Properties Video DELIVERY

Product Information

The material allows for simultaneous processing of die attach and leadframe embedding, while producing a void-free bondline for maximum thermal dissipation. Excellent RGA moisture results are acquired through the use of lead borate glass. LOCTITE ABLESTIK QMI2569 also offers improved processability by allowing in-line drying during the firing process on die as large as 0.800" x 0.800". Either multi-needle or starfish can be used to apply the material. LOCTITE ABLESTIK QMI2569 can only be used in hermetic packaging applications.

Void-free bondline
Maximum thermal dissipation

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.