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Properties
Specifications
Brand
Loctite
Packed With Dry Ice
no
Downloads
Manuals
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Manuals
LOCTITE ABLESTIK QMI529HT TDS
Revision
Version TDS
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ConRo cannot ensure and do not guarantee that the information in these documents is the most current available from the manufacturer. There are instances when updates are released without our immediate knowledge.
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Experience lOCTITE ABLESTIK QMI529HT is a high-performance die attach adhesive engineered for exceptional thermal conductivity and reliable bonding in demanding semiconductor applications. Order now to experience quality and reliability.
Experience lOCTITE ABLESTIK QMI529HT is a high-performance die attach adhesive engineered for exceptional thermal conductivity and reliable bonding in demanding semiconductor applications. Order now to experience quality and reliability.
LOCTITE ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.
Electrically conductive
Thermally conductive
Void-free bondline
Hydrophobic
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
