LOCTITE ABLESTIK QMI536

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LOCTITE ABLESTIK QMI536, Bismaleimide Resin, Die Attach, Fluoropolymer Filled Non-conductive Adhesive.

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From £241.11 Excl VAT £289.33 incl VAT

LOCTITE ABLESTIK QMI536, Bismaleimide Resin, Die Attach, Fluoropolymer Filled Non-conductive Adhesive.

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Datasheets Properties Video DELIVERY

Product Information

LOCTITE ABLESTIK QMI536 is a Fluoropolymer filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. This material is hydrophobic and stable at high temperatures. These features produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic and metal surfaces, including solder mask, BT, FR, polyimide, and Au. The adhesive also has excellent dielectric properties. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap cure oven, or utilize Skip Cure processing on a die bonder or wire bonder. The material is formulated to produce cure onset below 100°C. This can reduce or eliminate the need to pre-dry organic substrates prior to the die attach process. Please refer to the TDS for alternate cure times.

One component - requires no mixing
Stable at high temperatures
Hydrophobic
Excellent interfacial adhesive strength

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.