LOCTITE ABLESTIK 57C

LOCTITE ABLESTIK 57C Electrically Conductive Epoxy Adhesive

LOCTITE ABLESTIK 57C is a two-component, silver-filled epoxy adhesive formulated to provide both electrical and thermal conductivity in assembly applications. Designed for situations where hot soldering is impractical, the adhesive cures at room temperature to form reliable conductive connections.

The system consists of a silver epoxy resin (Part A) and silver hardener (Part B), requiring mixing prior to use. With a 100:100 mix ratio by weight or volume, the formulation delivers a thixotropic consistency for controlled placement and gap filling while maintaining good bond strength.

LOCTITE ABLESTIK 57C supports operation across a temperature range of -60°C to 120°C, making it suitable for demanding electronic and aerospace assemblies. The adhesive provides both mechanical bonding and conductive performance within a single material system.

Key Features

• Electrically conductive epoxy adhesive
• Thermally conductive formulation
• Silver-filled two-component system
• Thixotropic paste consistency
• Room temperature cure
• Good bond strength
• Operating temperature range: -60°C to 120°C

Mix Ratio

• By Weight (Part A : Part B) – 100 : 100
• By Volume (Part A : Part B) – 100 : 100

Typical Applications

Used in electronic assembly applications requiring electrically conductive bonding, particularly where soldering processes cannot be applied or where room temperature cure is preferred.