Your basket is empty. Continue shopping to add products to your basket.
Call Centre
Properties
Specifications
Brand
Loctite
Packed With Dry Ice
no
Downloads
Manuals
Revision
Download
Manuals
LOCTITE ECCOBOND FP4450HF TDS
Revision
Version TDS
Download
ConRo Electronics Ltd cannot ensure and do not guarantee that the information in these documents is the most current available from the manufacturer. There are instances when updates are released without our immediate knowledge.
Necessary cookies allow core website functionality such as user login and account management. The website cannot be used properly without necessary cookies.
Functional
Functionality cookies are used to remember visitor information on the website, eg. language, timezone, enhanced content.
Personalisation
Personalization cookies allow users to access web services with certain predefined elements, established through a series of criteria on the user's computer; these may include language preferences, the type of browser used to access services, the regional configuration from where the service is accessed, etc.
Analytics
Analytics cookies are used to see how visitors use the website, eg. analytics cookies. Those cookies cannot be used to directly identify a certain visitor.
Advertising
Advertising cookies are used to identify visitors between different websites, eg. content partners, banner networks. Those cookies may be used by companies to build a profile of visitor interests or show relevant ads on other websites.
We take your security very seriously and have put in place a number of measures that reduce the risk of the website being maliciously attacked. This means that sometimes content on our site will timeout.
Please try to complete the action again.
Please do not click back on your browser as this may cause further issues.
High-performance semiconductor packaging adhesive designed for advanced electronic applications. LOCTITE ECCOBOND FP4450HF provides excellent thermal stability and reliability for flip chip and CSP assemblies. Order now to experience quality and reliability.
High-performance semiconductor packaging adhesive designed for advanced electronic applications. LOCTITE ECCOBOND FP4450HF provides excellent thermal stability and reliability for flip chip and CSP assemblies. Order now to experience quality and reliability.
LOCTITE ECCOBOND FP4450HF is a high-performance epoxy adhesive formulated for use in microelectronics, offering superior adhesion, heat resistance, and long-term reliability. It is engineered to withstand the stresses of thermal cycling, ensuring durability and maintaining bond integrity even under harsh operating conditions. The formulation is suitable for advanced packaging applications where precision and performance cannot be compromised.
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
