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Properties
Specifications
Brand
Loctite
Packed With Dry Ice
no
Downloads
Manuals
Revision
Download
Manuals
LOCTITE ECCOBOND FP4531 SDS
Revision
Version SDS
Download
Manuals
LOCTITE ECCOBOND FP4531 TDS
Revision
Version TDS
Download
ConRo Electronics Ltd cannot ensure and do not guarantee that the information in these documents is the most current available from the manufacturer. There are instances when updates are released without our immediate knowledge.
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Experience lOCTITE ECCOBOND FP4531 is a high-performance underfill encapsulant used for semiconductor packaging. Delivers excellent adhesion, thermal cycling performance, and safeguarding for flip chip applications. Order now to experience quality and reliability.
Experience lOCTITE ECCOBOND FP4531 is a high-performance underfill encapsulant used for semiconductor packaging. Delivers excellent adhesion, thermal cycling performance, and safeguarding for flip chip applications. Order now to experience quality and reliability.
LOCTITE ECCOBOND FP4531 (also known as FLIPCHIP UNDERFILL -40CD) underfill is designed for flip chip on flex applications with a 1mil gap.
Snap curable
Fast flow
Passes NASA outgassing
Freezer Storage -40C
Please note the optimal storage for this material is -40C. Goods will be shipped in dry ice.
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
