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- LOCTITE ECCOBOND NCP 5209 - 10CC Syringe
LOCTITE ECCOBOND NCP 5209 - 10CC Syringe
Product Information
LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide fluxing activity to allow solder joint formation and bump protection reliability in flip chip bonding processes.
- High purity
- Non-conductive
- Excellent protection of electrical joints
- Compatible with small assembly gap and tight pitches
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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