LOCTITE ECCOBOND NCP 5209 - 10CC Syringe

Name: LOCTITE ECCOBOND NCP 5209 - 10CC Syringe
SKU: CEL008913
Price: 104.89 GBP
Availability: InStock

Conro PN: CEL008913

MPN: 1861555

LOCTITE ECCOBOND NCP 5209 - 10CC Syringe

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LOCTITE ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly.

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5 In StockAdditional stock available on 07 March 2025, if ordered today

£87.41 Excl VAT £104.89 incl VAT

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LOCTITE ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly.

+ More Details

Datasheets Properties Video DELIVERY

Product Information

LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide fluxing activity to allow solder joint formation and bump protection reliability in flip chip bonding processes.

High purity
Non-conductive
Excellent protection of electrical joints
Compatible with small assembly gap and tight pitches

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.