LOCTITE ECCOBOND UF 3811 epoxy underfill

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LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant.

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From £33.41 Excl VAT £40.09 incl VAT

LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant.

+ More Details

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Product Information

LOCTITE ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.

Room temperature flow capability
Low viscosity material flows at room temperature with no additional preheating required
High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
Cures quickly at moderate temperatures to minimize stress to other components

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.