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- LOCTITE ECCOBOND UF 3812 - 55CC Syringe
LOCTITE ECCOBOND UF 3812 - 55CC Syringe
Product Information
LOCTITE ECCOBOND UF 3812 reworkable epoxy underfill is designed for CSP, WLCSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
- Halogen-free
- Low viscosity material flows at room temperature with no additional preheating required
- High Tg and high fracture toughness enable excellent protection of solder joints during thermal cycling
- Room temperature flow capability
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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