BERGQUIST HI FLOW THF 900

Bergquist HI FLOW THF 900 is a phase-change thermal interface material specifically designed to replace traditional thermal grease, eliminating the mess, contamination, and handling challenges commonly associated with grease-based interfaces.

At room temperature, THF 900 is tack-free and scratch resistant, allowing easy handling and attachment to heat sinks without the need for a protective liner during shipment. When heated to approximately 65°C, the material undergoes a phase change from solid to flowable, ensuring complete wet-out of the thermal interface for consistent and reliable heat transfer.

The thixotropic characteristics of THF 900 help minimise pump-out under thermal cycling, while its low-volatility formulation supports long-term performance. With thermal performance comparable to grease, it provides a clean and dependable alternative for applications where electrical isolation is not required.

Key features & benefits

• Phase-change material designed to replace thermal grease
• Low thermal impedance of 0.37 °C-in²/W (@25 psi)
• Contact thermal resistance of 0.10 °C-in²/W, comparable to grease
• Tack-free and scratch resistant at room temperature
• No protective liner required when attached to heat sinks
• Low volatility (<1%) for stable long-term performance
• Thixotropic behaviour reduces pump-out during thermal cycling
• Easy to handle in manufacturing environments

Typical applications

• Grease replacement for thermal interfaces
• Heat sink to device thermal coupling
• Electronic assemblies where electrical isolation is not required
• Applications requiring clean, repeatable thermal performance