BERGQUIST GAP FILLER TGF 1000

BERGQUIST GAP FILLER TGF 1000 is a versatile two-part thermally conductive gap filler engineered to deliver dependable heat transfer and low mechanical stress in high-reliability electronic assemblies. With a thermal conductivity of 1 W/m-K, it provides effective thermal management for power devices, control modules and densely packed components requiring enhanced heat dissipation.

The material cures at room temperature, with optional accelerated curing for faster processing cycles. Once cured, it forms a soft, compliant interface that absorbs mechanical tolerances while reducing stress on sensitive components. Its excellent wet-out characteristics ensure uniform contact across surfaces, improving thermal performance in applications with variable gaps or irregular geometries.

BERGQUIST GAP FILLER TGF 1000 operates reliably across a wide temperature range from -60°C to +175°C, making it suitable for harsh aerospace, defence, automotive and industrial environments. It is also UL94 V-0 compliant, supporting safety requirements for flame resistance in mission-critical designs.

• Two-part, thermally conductive gap filler
• Thermal conductivity: 1 W/m-K
• Room-temperature cure with optional accelerated curing
• Soft, compliant interface minimises mechanical stress
• Reliable operation from -60°C to +175°C
• UL94 V-0 flame-retardant rating
• Dispensable formulation suitable for automated or manual dispensing
• Excellent wet-out for uniform coverage and improved thermal transfer

BERGQUIST GAP FILLER TGF 1000 offers a robust, high-performance solution for thermal management in advanced electronic assemblies where long-term reliability and safety are essential.