BERGQUIST GAP FILLER TGF 1000SR

BERGQUIST GAP FILLER TGF 1000SR is a specialised, two-part thermally conductive gap filler formulated with a soft-reducing cure profile to minimise mechanical stress in sensitive electronic assemblies. Providing a thermal conductivity of 1 W/m-K, it offers dependable heat transfer for power modules, control units and tightly packaged components that require both thermal efficiency and structural protection.

The material cures at room temperature, with the option for accelerated curing to support higher production throughput. Its soft, compliant final cure helps absorb interface tolerances and maintain long-term reliability in assemblies where mechanical load must be carefully controlled.

Engineered for use across an operational range of -60°C to +175°C, BERGQUIST GAP FILLER TGF 1000SR performs well in demanding aerospace, defence, automotive and industrial environments. The formulation also meets UL94 V-0 flame-retardant requirements, ensuring compliance with stringent safety standards.

• Two-part, thermally conductive gap filler
• Thermal conductivity: 1 W/m-K
• Soft-reducing cure for minimal mechanical stress
• Room-temperature or accelerated curing options
• Operating temperature range: -60°C to +175°C
• UL94 V-0 flame-retardant rating
• Excellent wet-out for uniform thermal contact
• Suitable for sensitive components requiring controlled stress profiles

BERGQUIST GAP FILLER TGF 1000SR delivers a reliable thermal interface solution where low mechanical stress, thermal conductivity and safety compliance are critical to long-term performance.