BERGQUIST GAP FILLER TGF 1500LVO

BERGQUIST GAP FILLER TGF 1500LVO is a low-volatility, two-component thermal gap filler designed for sensitive electronic and aerospace applications where minimal outgassing and stable long-term performance are essential.With a thermal conductivity of 1.8 W/m·K, it provides efficient heat transfer while maintaining excellent surface conformity across complex geometries.

The material cures at room temperature or can be heat-accelerated to suit production needs.Its lower adhesion strength makes it ideal for assemblies that are fragile or not intended to be permanently bonded, ensuring thermal performance without stressing delicate components.

TGF 1500LVO features an ultra-conforming, self-levelling formulation that delivers outstanding wet-out on uneven surfaces, reducing thermal impedance and improving cooling efficiency.Because it is a 100% solids system, it produces no cure by-products, making it suitable for enclosed systems, optical assemblies, and silicone-sensitive environments.

• Low-volatility formulation designed for silicone-sensitive and contamination-controlled environments
• Thermal conductivity: 1.8 W/m·K for efficient heat dissipation
• Ultra-conforming with excellent wet-out across irregular surfaces
• 100% solids — no cure by-products released during processing
• Cures at room temperature or can be accelerated with heat
• Lower adhesion strength ideal for fragile components or non-permanent bonds
• Soft, compliant cured interface accommodates vibration and thermal cycling
• Suitable for avionics, sensors, optical systems, and high-density power electronics

BERGQUIST GAP FILLER TGF 1500LVO delivers reliable, low-outgassing thermal performance for mission-critical systems where cleanliness, stability, and effective heat transfer are essential.