BERGQUIST GAP FILLER TGF 3010APS

Henkel BERGQUIST GAP FILLER TGF 3010APS is a high-performance, silicone-free, fast-dispensing liquid gap filler offering 3.0 W/m-K thermal conductivity for high-throughput aerospace and aviation electronics applications.

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From £1,399.52 Excl VAT £1,679.42 incl VAT

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Product Information

BERGQUIST GAP FILLER TGF 3010APS is a two-component, silicone-free, dispensable liquid gap filler engineered for demanding aerospace, aviation, defence, OEM, and MRO applications. Designed for extremely high throughput, it delivers an exceptional dispense rate of over 80 cc/sec and cures at room temperature, supporting efficient and scalable manufacturing processes.

This material combines high thermal conductivity of 3.0 W/m-K with low compressive stress, making it suitable for assemblies requiring reliable heat dissipation without introducing mechanical strain. Its compressible nature (Shore OO 75) ensures effective conformity to component surfaces, achieving stable long-term thermal contact in mission-critical electronic systems.

Key Properties:

Silicone-free, two-component liquid gap filler
High thermal conductivity: 3.0 W/m-K
Fast dispense rate: > 80 cc/sec for high-volume production
Compressible formulation (Shore OO 75) for low-stress assembly
Room temperature curing as standard
Ideal for high-throughput thermal management applications in aerospace electronics

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.