BERGQUIST GAP FILLER TGF 4000

BERGQUIST GAP FILLER TGF 4000 is a high-performance, ultra-conforming, two-component liquid gap filler designed for demanding aerospace, aviation, defence, OEM, and MRO thermal management applications. The material cures at room temperature, with the option for heat acceleration, and features an extended working time to support flexible manufacturing workflows across complex electronic assemblies.

With a thermal conductivity of 4 W/m-K, TGF 4000 provides efficient heat dissipation while maintaining excellent wet-out for strong thermal contact. Its low natural tack makes it suitable for applications where structural adhesion is not required, helping reduce stress on delicate components. Formulated with 100% solids and no cure by-products, it delivers clean, reliable performance in environments sensitive to contamination, outgassing, or mechanical load.

Key Properties:

• Thermal conductivity: 4 W/m-K for high-efficiency heat transfer
• Ultra-conforming with excellent surface wet-out
• 100% solids with no cure by-products for clean, stable performance
• Extended working time offering improved manufacturing flexibility
• Room temperature cure with optional heat acceleration
• Low natural tack suitable for non-structural aerospace assemblies