BERGQUIST GAP FILLER TGF 4500CVO

BERGQUIST GAP FILLER TGF 4500CVO is a silicone-based, two-component liquid gap filler engineered for high-reliability aerospace, aviation, defence, OEM, and MRO applications. Designed to support efficient automated dispensing processes, the formulation features optimised viscosity for smooth, consistent flow and high deposition rates, enabling streamlined production across mission-critical electronic assemblies.

The material provides infinite thickness variability without adding stress to delicate components, making it ideal for low-stress interface applications. With a high thermal conductivity of 4.5 W/m-K, extended working time, and controlled volatile silicone content, TGF 4500CVO ensures stable, long-term performance in contamination-sensitive environments commonly found in aerospace electronics.

Key Properties:

• Thermal conductivity: 4.5 W/m-K for efficient heat dissipation
• Extended working time to support flexible manufacturing workflows
• Controlled volatile silicones for contamination-sensitive applications
• High dispensing rate with optimised viscosity for automated production
• Supports infinite thickness variations without inducing stress
• Suitable for low-stress, high-reliability aerospace assemblies