BERGQUIST GAP PAD TGP 1000HD

BERGQUIST GAP PAD TGP 1000HD is a high-performance, mechanically robust thermal interface pad engineered for aerospace, aviation, defence, OEM, and MRO applications requiring dependable heat transfer and long-term durability. Its formulation provides enhanced tear resistance and high durability while maintaining excellent conformability to uneven component surfaces, ensuring stable thermal contact in demanding electronic assemblies.

TGP 1000HD delivers consistent thermal performance with a conductivity of 1.0 W/m-K and is designed to minimise mechanical stress on sensitive components. Its balance of softness and strength makes it suitable for applications where repeated handling, vibration exposure, or assembly pressure may otherwise damage conventional gap pads. The material is ideal for avionics, power modules, control systems, and other mission-critical aerospace electronics.

Key Properties:

• Thermal conductivity: 1.0 W/m-K
• High-durability formulation with excellent tear and puncture resistance
• Conformable surface for effective wet-out and improved heat transfer
• Low-stress interface to protect sensitive aerospace components
• Reliable performance in vibration-prone and harsh environments