BERGQUIST GAP PAD TGP 1000VOUS

BERGQUIST GAP PAD TGP 1000VOUS Thermally Conductive Gap Pad is an ultra-conformable, thermally conductive silicone gap pad designed to fill air gaps between heat generating components and heat sinks in electronic assemblies. The material provides reliable thermal transfer while maintaining electrical insulation, making it suitable for high-voltage device applications.

This pre-cured thermal interface material features a low modulus structure that helps absorb mechanical stress and vibration, improving long-term reliability in sensitive electronic systems. Its soft construction allows the pad to conform easily to uneven surfaces, ensuring effective contact and consistent thermal performance.

BERGQUIST GAP PAD TGP 1000VOUS is commonly used where electrical isolation and thermal management are required between heat sinks and high-voltage, bare-leaded devices.

Key Features

• Ultra conformable silicone gap pad
• Thermal conductivity: 1 W/m·K
• High dielectric strength for electrical insulation
• Self-tacky surface for easy placement
• Shock absorbing and vibration damping properties

Typical Applications

• Thermal interface between heat sinks and electronic components
• Electrical isolation in high-voltage devices
• Power electronics and control modules
• Electronic assemblies requiring gap filling and thermal management