- Home
- Adhesives
- Thermal Gap Fillers
- BERGQUIST GAP PAD TGP 1100SF
BERGQUIST GAP PAD TGP 1100SF
Product Information
BERGQUIST GAP PAD TGP 1100SF is a silicone-free, thermally conductive gap pad. Being silicone free, there is no silicone outgassing and silicone extraction. It is not only thermally conductive but also electrically isolating. This product is therefore ideal for silicone sensitive applications.
- Thermal conductivity: 0.9 W/m-K
- Silicone free
- Room temperature as well as accelerated curing possible
- UL94 V-1 compliance
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
Video
No video available.
Similar Products
You May Be Interested In
Recently Viewed
There are no recently viewed products.