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BERGQUIST GAP PAD TGP 3000ULM
Product Information
It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation.
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Ultra low modulus
- Non-fiberglass option for applications that require an additional reduction in stress
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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