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BERGQUIST GAP PAD TGP 3004SF
Product Information
BERGQUIST GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces.This product has no silicone content and is therefore ideal for silicone sensitive applications.
- Thermal conductivity: 3 W/m-K
- Silicone free
- UL94 V-0 compliance
- Reworkable
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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