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- BERGQUIST GAP PAD TGP HC1000 16in x 8in x 0.015 sh (GPHC1000-0.015-02-0816)
BERGQUIST GAP PAD TGP HC1000
Product Information
Bergquist GAP PAD TGP HC1000 is a highly conformable, low-modulus thermal gap filling material designed to act as a thermal interface and electrical insulator between electronic components and heat sinks.
The unique “gel-like” modulus allows the material to easily conform to rough and irregular surfaces, filling air gaps to enhance thermal performance while applying minimal stress to components. This makes TGP HC1000 well suited to delicate assemblies that require gentle contact pressure.
The material is fiberglass reinforced to improve puncture, shear, and tear resistance, supporting durability during handling and assembly. BERGQUIST GAP PAD TGP HC1000 is supplied with removable protective liners on both sides for ease of handling and installation.
Key features
- Thermal conductivity of 1.0 W/m·K
- Highly conformable, low hardness material
- “Gel-like” modulus for effective air gap filling
- Fiberglass reinforced for puncture, shear, and tear resistance
- Electrically insulating
- Operating temperature range from -60 °C to 200 °C
- Supplied with removable protective liners on both sides
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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