BERGQUIST GAP PAD TGP HC3000

Bergquist GAP PAD TGP HC3000 is a high-compliance thermal gap pad with 3.0 W/m·K conductivity, designed to deliver excellent thermal performance at low compression forces.

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From £0.11 Excl VAT £0.13 incl VAT

Bergquist GAP PAD TGP HC3000 is a high-compliance thermal gap pad with 3.0 W/m·K conductivity, designed to deliver excellent thermal performance at low compression forces.

+ More Details

Datasheets Properties Video DELIVERY

Product Information

Bergquist GAP PAD TGP HC3000 is a high-compliance thermal interface material engineered to deliver excellent thermal performance at low pressures.

The material uses a unique filler package combined with a low modulus formulation, allowing it to conform easily to rough and irregular surfaces. This results in excellent wet-out at the thermal interface while applying minimal stress to components and circuit boards during assembly.

TGP HC3000 is reinforced with fiberglass to improve shear and tear resistance, making it suitable for demanding assemblies where both durability and low compression stress are required.

Key features

Thermal conductivity of 3.0 W/m·K
High-compliance, low compression stress material
Excellent wet-out on rough and irregular surfaces
Fiberglass reinforced for improved shear and tear resistance

Typical applications

Fragile electronic components
Low-pressure thermal gap filling
Assemblies with uneven or irregular surfaces
Applications requiring minimal stress on boards and components

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.