BERGQUIST LIQUI FORM TLF 10000

Specially designed for the Data & Telecom market, Bergquist LIQUI FORM TLF 10000 is a high-performance, thermally conductive gel interface material developed to meet the demanding thermal management requirements of modern communications infrastructure.

The advanced formulation delivers an optimal balance of very high thermal conductivity, efficient dispensing, and long-term thermal reliability. It is specifically engineered to provide effective electronic component cooling for 5G base stations and remote antenna assemblies, where reliable vertical gap stability and low thermal impedance are critical.

Supplied as a pre-cured gel, TLF 10000 requires no mixing or refrigeration, simplifying handling and supporting consistent processing in production and field deployment environments.

Key features & benefits

• Very high thermal conductivity of 10 W/m·K (ASTM D5470) for efficient heat transfer
• Low thermal impedance to maximise cooling performance
• Pre-cured gel formulation requiring no mixing or refrigeration
• Excellent vertical gap stability for upright and narrow-gap assemblies
• Excellent thermal cycling performance for long-term reliability
• Optimised dispense properties for controlled, repeatable application

Typical applications

• Thermal interface material for data and telecom equipment
• 5G base stations and remote antenna units
• High-reliability thermal management in communications infrastructure