BERGQUIST LIQUI FORM TLF 3800LVO

Bergquist LIQUI FORM TLF 3800LVO is a highly thermally conductive, pre-cured thermal interface gel designed for applications requiring low volatility, stable placement, and long-term reliability.

The thixotropic formulation provides natural surface tack, allowing the material to conform around sensitive components and remain securely in place after application. With no mixing, curing, or refrigeration required, TLF 3800LVO simplifies processing while delivering excellent chemical and mechanical stability in silicone-sensitive environments.

Key features & benefits

• Thermal conductivity of 3.8 W/m·K for efficient heat dissipation
• Dispensable pre-cured gel requiring no mixing, curing, or refrigeration
• Low volatility formulation suitable for silicone-sensitive applications
• Thixotropic material with natural tack to stay in place after application
• Excellent chemical and mechanical stability for long-term performance
• Stable viscosity in storage and during application

Typical applications

• Thermal interface material for electronic and power assemblies
• Low-outgassing or silicone-sensitive environments
• High-reliability thermal management in demanding systems