BERGQUIST LIQUI FORM TLF 6000HG

Bergquist LIQUI FORM TLF 6000HG is a high-performance, thermally conductive, pre-cured gel engineered for demanding thermal management applications where vertical gap stability and long-term reliability are critical.

The unique formulation delivers effective heat dissipation while maintaining stable viscosity during storage and application. As a pre-cured material, it requires no mixing or refrigeration, simplifying handling and processing. TLF 6000HG is particularly well suited for filling narrow gaps and maintaining consistent thermal contact in vertically oriented assemblies.

Key features & benefits

• High thermal conductivity of 6.0 W/m·K for efficient heat transfer
• Dispensable pre-cured gel requiring no mixing or refrigeration
• Excellent vertical gap stability for reliable performance in upright assemblies
• Stable viscosity in storage and during application
• Highly conformable material for filling narrow and uneven gaps
• Excellent chemical and mechanical stability for long-term reliability

Typical applications

• Thermal interface material for electronic components
• Remote antenna assemblies and communications equipment
• High-reliability thermal management in vertically oriented systems