BERGQUIST LIQUI FORM TLF LF2000

Bergquist LIQUI FORM TLF LF2000 is a thermally conductive, pre-cured and dispensable gel material designed for thermal interface applications where low applied force and long-term reliability are critical.

The formulation exhibits low volumetric expansion and applies minimal mechanical stress during assembly, helping protect sensitive components. With excellent chemical and mechanical stability, even at elevated temperatures, LF2000 delivers consistent thermal performance throughout the service life of the assembly.

Key features & benefits

• Very low applied force during assembly to protect delicate components
• Low volumetric expansion for dimensional stability over time
• Thermal conductivity of 2.0 W/m·K for reliable heat dissipation
• Pre-cured gel formulation requiring no mixing or curing
• Dispensable material for controlled and repeatable application
• Excellent chemical and mechanical stability at high operating temperatures

Typical applications

• Thermal interface material for electronic and electro-mechanical assemblies
• Gap-filling thermal management solutions
• Assemblies requiring low-stress, long-life thermal interface materials