BERGQUIST LIQUI FORM TLF LF3500

Bergquist LIQUI FORM TLF LF3500 is a thermally conductive, dispensable and highly conformable thermal interface material engineered for applications requiring excellent heat transfer combined with low mechanical stress on components.

This pre-cured gel is designed to strike an optimal balance between easy dispensability and reduced component stress during application and assembly. Its unique formulation delivers consistent thermal performance while maintaining stable viscosity, supporting repeatable processing and long-term reliability.

Key features & benefits

• Dispensable pre-cured gel for controlled, clean application
• High thermal conductivity of 3.5 W/m·K for efficient heat dissipation
• Highly conformable material to accommodate surface irregularities
• Low applied stress to help protect sensitive components
• Stable viscosity in storage and during dispensing
• Excellent chemical and mechanical stability for long-term performance

Typical applications

• Thermal interface for heat-generating electronic components
• Gap-filling thermal management applications
• Assemblies requiring dispensable, low-stress TIM solutions