BERGQUIST SIL PAD TSP 1200

BERGQUIST SIL PAD TSP 1200 Thermal Interface Insulator Pad is a high-performance, thermally conductive silicone insulator pad designed for aerospace, aviation, defence, OEM, and MRO electronics where controlled heat transfer and dependable electrical isolation are required. Built on the proven SIL PAD platform, it supports consistent thermal management in compact assemblies without the mess of thermal grease.

The composite construction combines silicone rubber with reinforcement for added durability, helping the pad maintain contact and integrity under assembly loads and in-service conditions. TSP 1200 is engineered to reduce thermal resistance versus earlier SIL PAD grades, supporting improved heat dissipation where stable dielectric isolation is critical.

Key features

• Thermally conductive, electrically insulating silicone interface pad
• Reinforced construction to support handling strength and long-term stability
• Designed to help reduce thermal resistance compared with prior SIL PAD grades
• Grease-free interface for cleaner assembly and repeatable placement
• Suitable for temperature cycling environments common in aerospace electronics

Typical use in aerospace electronics

• Thermal interface insulation between heat-generating components and grounded surfaces
• Avionics modules, power electronics, and control units requiring dielectric separation
• Assemblies where consistent pad thickness supports predictable interface performance

General specifications

• Operating temperature range: -60°C to 180°C
• Nominal thickness: 0.009in (where specified)
• Format: available in multiple pre-cut pad sizes (see variant dimensions)