BERGQUIST SIL PAD TSP 1200

BERGQUIST SIL PAD TSP 1200 is a high-performance thermally conductive insulator developed for aerospace, aviation, defence, OEM, and MRO electronic applications where efficient thermal management and reliable electrical isolation are critical. It offers the same proven mechanical and physical characteristics as BERGQUIST SIL PAD TSP 900, while delivering approximately 35% lower thermal resistance for improved heat dissipation.

The material is a composite of silicone rubber and fiberglass reinforcement, filled with boron nitride to achieve low thermal resistance and stable thermal conductivity. Its smooth, compliant structure supports effective interface contact while maintaining durability under assembly and operational stresses.

BERGQUIST SIL PAD TSP 1200 is flame retardant, non-toxic, and resistant to damage from common cleaning agents, making it well suited for high-reliability electronic packaging. Designed to function as a thermally conductive insulator, it supports consistent thermal performance across a wide operating temperature range without the need for thermal greases.

Key Properties:

• High-performance thermally conductive and electrically insulating pad
• Silicone-based material with fiberglass reinforcement
• Boron nitride filled for low thermal resistance
• Approximately 35% lower thermal resistance than TSP 900
• Flame retardant and non-toxic
• Resistant to common cleaning agents
• Operating temperature range: -60°C to 180°C
• Total thickness: 0.23 ± 0.025 mm (ASTM D374)