BERGQUIST SIL PAD TSP 1500

BERGQUIST SIL PAD TSP 1500 is an electrically insulating, thermally conductive elastomeric material designed for high-reliability electronic packaging applications across aerospace, aviation, defence, OEM, and MRO environments. Its formulation is optimised to enhance both thermal transfer and dielectric performance while operating as a clean, grease-free interface.

The silicone elastomer construction provides a highly conformable surface that adapts closely to mating interfaces. This conformity helps minimise interfacial air gaps, reducing thermal resistance and enabling efficient heat dissipation without the need for thermal greases or excessive clamping pressure.

BERGQUIST SIL PAD TSP 1500 is well suited for applications requiring consistent thermal management, dependable electrical isolation, and long-term reliability. Its balance of performance and handling characteristics makes it a practical solution for demanding electronic assemblies where both thermal and electrical integrity are critical.

Key Properties:

• Thermal impedance: 0.46°C·in²/W at 50 psi
• Silicone elastomer, thermally conductive material
• Electrically insulating
• Highly conformable, grease-free interface
• Designed for high-reliability electronic packaging