BERGQUIST SIL PAD TSP 1800

BERGQUIST SIL PAD TSP 1800 is a thermally conductive, silicone-based elastomeric thermal interface material developed for aerospace, aviation, defence, OEM, and MRO applications where consistent heat dissipation and electrical isolation are required. The material is designed for placement between electronic power devices and heat sinks in screw- or clip-mounted assemblies.

Reinforced with fiberglass, TSP 1800 provides strong mechanical integrity alongside excellent dielectric performance. Its smooth, non-tacky surface on both sides allows easy repositioning during installation, helping reduce assembly errors and supporting efficient handling in production and maintenance environments. An optional adhesive coating is available to suit specific application needs.

BERGQUIST SIL PAD TSP 1800 exhibits exceptional thermal performance at lower application pressures, making it well suited for assemblies where high clamping force is not available. The elastomeric structure promotes effective surface wet-out, reducing interfacial resistance and supporting dependable long-term thermal performance without the use of greases.

Key Properties:

• Thermal impedance: 0.53°C·in²/W at 50 psi
• Silicone-based, elastomeric thermal interface material
• Fiberglass-reinforced for mechanical strength and durability
• Exceptional thermal performance at lower application pressures
• Smooth, non-tacky surfaces for easy repositioning and error reduction
• Superior breakdown voltage and excellent surface wet-out characteristics