BERGQUIST SIL PAD TSP 900

BERGQUIST SIL PAD TSP 900 is a silicone-based, thermally conductive and electrically insulating thermal interface material developed for aerospace, aviation, defence, OEM, and MRO applications. As the original Sil-Pad material, it is widely used to electrically isolate power-generating components from heat sinks while maintaining dependable thermal performance.

The pad is reinforced with fiberglass, delivering excellent cut-through resistance along with strong mechanical and physical stability. This reinforcement allows the material to withstand assembly stresses while maintaining consistent interface integrity over time. Notably, the thermal resistance of TSP 900 improves with age, supporting long-term reliability in demanding electronic environments.

BERGQUIST SIL PAD TSP 900 is flame retardant and supplied in a grease-free format, eliminating the handling and contamination concerns associated with thermal pastes. Available in a wide range of pre-cut sizes, sheets, and roll configurations, it provides flexibility to suit standard and high-reliability electronic packaging requirements.

Key Properties:

• Thermal impedance: 1.13°C·in²/W at 50 psi
• Silicone-based, thermally conductive and electrically insulating material
• Fiberglass reinforcement for excellent cut-through resistance
• Thermal resistance improves with age
• Flame-retardant construction
• Original BERGQUIST Sil-Pad material