BERGQUIST SIL PAD TSP A2000

BERGQUIST SIL PAD TSP A2000 is a silicone-based thermal interface material designed for aerospace, aviation, defence, OEM, and MRO applications where high thermal performance and dependable electrical insulation are required. The material consists of a cured silicone elastomeric compound coated on both sides of a fiberglass reinforcement layer, delivering a robust and stable interface for demanding electronic assemblies.

Engineered to perform effectively under clamping pressures of up to 200 psi, TSP A2000 is well suited for high-performance applications where cut-through resistance and mechanical durability are critical. Its smooth surface finish makes the pad less sensitive to variations in clamping pressure, helping maintain consistent thermal contact across the interface.

By combining thermal conductivity with electrical isolation in a grease-free format, BERGQUIST SIL PAD TSP A2000 provides clean handling, repeatable installation, and long-term reliability in mission-critical electronic packaging.

Key Properties:

• Thermal impedance: 0.42°C·in²/W at 50 psi
• Silicone-based, thermally conductive and electrically insulating material
• Elastomeric compound coated on both sides of fiberglass reinforcement
• Performs under clamping pressures up to 200 psi
• High cut-through resistance for demanding assemblies
• Smooth surface finish for reduced sensitivity to clamping pressure