BERGQUIST SIL PAD TSP A3000

BERGQUIST SIL PAD TSP A3000 is a thermally conductive, silicone elastomer thermal interface material designed for aerospace, aviation, defence, OEM, and MRO applications where optimal heat transfer is a critical requirement. The formulation is engineered to maximise both thermal and dielectric performance within the filler and binder matrix, delivering consistent results in high-reliability electronic packaging.

This grease-free, conformable pad adapts to mating surface irregularities under assembly pressure, reducing interfacial resistance and improving overall thermal performance, particularly at lower applied pressures. With a thermal conductivity of 3.0 W/m-K, TSP A3000 supports efficient heat dissipation in power electronics, avionics modules, and densely populated electronic systems.

By eliminating the variability and handling challenges associated with thermal greases, BERGQUIST SIL PAD TSP A3000 enables clean processing, repeatable installation, and long-term stability in demanding operating environments.

Key Properties:

• High thermal conductivity: 3.0 W/m-K
• Low thermal impedance: 0.32°C·in²/W at 50 psi
• Reduced interfacial resistance for improved performance at low pressures
• Silicone elastomer construction for excellent conformability
• Grease-free solution for clean, reliable assembly
• Suitable for high-reliability electronic packaging applications