BERGQUIST BOND PLY TBP 400

BERGQUIST BOND PLY TBP 400 is a high-performance thermally conductive adhesive film engineered for applications requiring both strong mechanical bonding and reliable electrical insulation. This material delivers excellent thermal conductivity, enabling efficient heat transfer from electronic components to heatsinks or heat spreaders while maintaining robust structural stability.

Designed for easy, clean assembly, TBP 400 features a pressure-sensitive adhesive system that simplifies installation and eliminates the need for liquid adhesives or external hardware such as screws or clips. Its uniform bond line thickness ensures predictable thermal performance, while its conformable construction provides reliable adhesion across complex surfaces.

• Thermally conductive adhesive film for efficient heat dissipation
• Strong mechanical bonding with dependable electrical insulation
• Easy application for streamlined assembly processes
• Thermal impedance: 0.87°C-in²/W (@ 50 psi)
• Available with easy-release tabs for fast, clean handling
• Eliminates the need for external mounting hardware
• Consistent bond line thickness for stable thermal performance
• Reliable under vibration, thermal cycling, and environmental stress
• Ideal for power modules, LED assemblies, automotive systems, and industrial electronics

BERGQUIST BOND PLY TBP 400 is widely used across aerospace, defence, automotive, and industrial sectors where durable bonding and high-efficiency thermal management are critical to equipment reliability.