BERGQUIST BOND PLY TBP 400B

BERGQUIST BOND PLY TBP 400B is a high-performance thermally conductive adhesive film engineered for applications requiring strong mechanical bonding, dependable electrical insulation, and excellent thermal transfer.Designed for clean and easy assembly, TBP 400B provides reliable adhesion between components and heatsinks without the need for liquid adhesives or external mounting hardware.

The material maintains a consistent bond line thickness to ensure predictable thermal performance, while its conformable structure enhances surface contact even across slight component height variations.TBP 400B delivers stable performance under vibration, temperature cycling, and environmental exposure, making it suitable for demanding power electronics and industrial applications.

• Thermally conductive adhesive film for efficient heat dissipation
• Strong mechanical bonding paired with electrical insulation
• Thermal impedance: 0.87°C-in²/W (@ 50 psi)
• Easy application with clean handling characteristics
• Available with easy-release tabs for improved assembly workflow
• Eliminates the need for external hardware such as screws or clips
• Consistent bond line thickness for predictable thermal performance
• Durable under vibration, thermal cycling, and challenging environments
• Suitable for power modules, LED assemblies, automotive electronics, and industrial systems

BERGQUIST BOND PLY TBP 400B is widely used across aerospace, defence, automotive, and industrial electronics where high-efficiency thermal management and secure adhesive bonding are essential for long-term reliability.