BERGQUIST BOND PLY TBP 400P

BERGQUIST BOND PLY TBP 400P is a high-performance thermally conductive adhesive film engineered to deliver strong mechanical bonding and dependable electrical insulation in demanding electronic applications. Designed with a pressure-sensitive adhesive (PSA) system, TBP 400P enables fast, clean assembly without the need for liquid adhesives or external fastening hardware.

The material maintains a uniform bond line thickness for predictable thermal behaviour, while its conformable construction enhances contact between surfaces to support efficient heat transfer. TBP 400P is designed for stability under vibration, thermal cycling, and environmental exposure, making it suitable for rugged, high-reliability sectors such as aerospace, automotive, and industrial power electronics.

• Thermally conductive adhesive film for efficient heat dissipation
• Strong mechanical bonding combined with electrical insulation
• Thermal impedance: 0.87°C-in²/W (@ 50 psi)
• Easy, clean application enabled by pressure-sensitive adhesive technology
• Available with easy-release tabs to streamline assembly
• Eliminates screws, clips, and other external fastening hardware
• Consistent bond line thickness ensures stable thermal performance
• Durable under vibration, thermal cycling, and harsh operating environments
• Ideal for power modules, LEDs, automotive systems, and industrial electronics

BERGQUIST BOND PLY TBP 400P is widely used across aerospace, defence, and high-performance electronics where efficient thermal management and secure adhesive bonding are essential for long-term reliability.