BERGQUIST LIQUI BOND TLB SA2005RT

Bergquist LIQUI BOND TLB SA2005RT is a two-part, high-performance, thermally conductive silicone adhesive designed for applications requiring reliable thermal management combined with durable bonding.

The adhesive cures and bonds at room temperature, with the option to significantly accelerate cure using heat. Its adaptive thermal cure system produces no cure by-products, supporting clean processing and consistent bond quality. Once cured, SA2005RT delivers dependable thermal performance and mechanical stability across a wide operating temperature range.

Key features & benefits

• Thermal conductivity of 2.0 W/m·K for effective heat dissipation
• Two-part silicone adhesive with 1:1 mix ratio by weight and volume
• Cures and bonds at room temperature with optional heat acceleration
• Adaptive thermal cure with no cure by-products
• Wide operating temperature range from -60 to 180°C
• UL 94 V-0 flammability rating for added safety compliance
• Room-temperature storage for simplified handling and logistics

Typical properties

• Technology: Silicone
• Appearance (Part A): Red
• Appearance (Part B): Blue
• Appearance (cured): Violet
• Mix ratio: 1:1 by weight and by volume
• Operating temperature range: -60 to 180°C

Typical applications

• Thermal interface bonding for electronic assemblies
• Structural thermal adhesive applications
• Assemblies requiring room-temperature cure with optional heat acceleration