BERGQUIST SIL PAD TSP PP900

BERGQUIST SIL PAD TSP PP900 is a fiberglass-reinforced, polyester-based thermal interface insulator engineered for aerospace, aviation, defence, OEM, and MRO applications where reliable thermal performance is required at an economical cost point. As part of the BERGQUIST SIL PAD family, PP900 is intended for standard-performance electronic assemblies that demand consistent heat transfer and electrical insulation.

The material is constructed using a fiberglass carrier coated with filled polyester resin, providing a balanced combination of thermal conductivity, dielectric strength, and mechanical stability. Its non-silicone formulation makes it well suited for silicone-sensitive environments and compatible with applications requiring conformal coatings, such as telecom and selected aerospace electronics.

When clamped between heat-generating components and heat sinks, BERGQUIST SIL PAD TSP PP900 delivers stable and repeatable thermal contact without the handling challenges, migration, or contamination risks associated with thermal greases. Available in a wide range of pre-cut sizes, sheets, and roll formats, it offers flexibility to match individual application and production requirements.

Key Properties:

• Thermal impedance: 1.13°C·in²/W at 50 psi
• Polyester-based, non-silicone thermal interface material
• Fiberglass-reinforced for durability and dimensional stability
• Compatible with conformal coating processes
• Designed for silicone-sensitive standard applications
• Available in multiple sizes, sheet, and roll configurations