Indium Engineered Solders

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Next day delivery on in stock items ordered before 4.30pm

 

Product Description

  • AuSn Preforms

    Indalloy®182 (80Au/20Sn) has a melting point of 280°C (556°F). It can be made into solder preforms with various options to address specific applications. Gold-tin solder preforms are generally used in applications that require a high-melting temperature (over 150°C), good thermal fatigue properties, and high-temperature strength. It is also used in applications that require high tensile strength and high corrosive resistance, or in step soldering applications where the preform will not melt during a subsequent low-temperature reflow process. This alloy is suitable for fluxless soldering as well. For these reasons, Indalloy®182 solder preforms are an obvious choice for die bonding applications. The inherent attributes of AuSn alloys are preferable for high power die. However, some attributes must be engineered into the preform in order to optimize performance: Alloy Chemistry, Geometry, and Packaging.

    • Packaging Options
      • Waffle Tray, Tape & Reel:
    • Next day delivery in stock items ordered before 4.30pm

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Product Specification

  • High-temperature strength, high-melting point solder
  • Corrosion resistant
  • Compatible with other precious metals

Product Description

  • Bismuth Solder

    Bismuth (Bi) is being used more and more as a replacement for lead in solder alloys because it is non-toxic. Although the melting temperature of pure bismuth is 271°C, the addition of bismuth will lower the melting temperature of most metals it is alloyed with. Bismuth compounds are also widely used in medical and cosmetic applications.

    • Packaging Options
      • Paste, Wire, Spheres, Preforms, Ribbon/Foil:
    • Next day delivery in stock items ordered before 4.30pm

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Product Specification

  • The most popular lead-free bismuth solder alloys are Indalloy®281 (58Bi/42Sn) which melts at 138°C and Indalloy®282 (57Bi/42Sn/1Ag) which melts at 140°C. The addition of the 1% Ag makes the alloy more malleable. Both alloys can be used for step soldering applications. After the initial joints are made with a standard SAC alloy (220°C), subsequent soldering operations can be done using the bismuth alloys. See the table on the back of this sheet for additional alloys.
  • Indalloy®281 and Indalloy®282 have joint properties similar to those of tin-lead solders, with superior fatigue and copper dissolution characteristics.
  • Bismuth is the most diamagnetic and the least thermally conductive of all metals.
  • In addition to being non-toxic, it does not oxidize as readily as lead does.

Product Description

  • Solder Fortification Preforms

    Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly fitted components, make this increasingly difficult. Solder Fortification® Preforms can provide the solution for these challenging issues. Solder Fortification® Preforms are generally rectangle- or disc-shaped pieces of alloyed metal that do not contain any flux. The preform is added to a deposit of solder paste using standard pick and place equipment. Since the alloy for both the preform and the solder paste are the same, the preform will reflow at the same temperature as the solder paste, with the solder paste providing the necessary flux. The preform increases the volume of solder above what could be achieved with just solder paste, especially for stencils with a pitch of 0.3mm or less.

Product Specification

  • Increased solder volume
  • Improved drop test results
  • Fewer issues with flux residue
  • Reduced rework
  • Improved fillet shape and volume

Product Description

  • Flux coating for solder preforms

    Indium Corporation’s no-clean flux coatings are formulated specifically for solder preforms, combining the latest flux technologies to satisfy the most recent requirements for no-clean and RoHS- and REACH-compliant materials. Flux-coated preforms eliminate the costly production step of separate fluxing and provide a repeatable, precise, and uniform amount of flux every time.

    • Packaging Options
      • Waffle Tray, Tape & Reel:
    • Next day delivery in stock items ordered before 4.30pm

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Product Specification

NC-10HF is the newest addition to Indium Corporation’s selection of flux coatings for solder preforms. It is halide-free and has excellent wetting. NC-7 is the most mildly activated of the no-clean flux coating series. It meets all current industry-wide halogen-free and halide-free requirements. NC-9 contains a small amount of halogen. It provides superior reliability on even the most sensitive electronic assemblies. NC-9 has activity approaching that of a fully activated rosin flux while maintaining its no-clean status. This enables solder to wet to most standard electronic surface finishes.

Product Description

  • Solder Ribbon and Foil

    High-quality Solder Ribbon and Foil manufactured by Indium Corporation is available in many standard alloys and sizes. Material can also be custom made to your unique material and dimensional requirements. Solder Ribbon is supplied in continuous lengths and is packaged on spools. Solder Foil is supplied in sheet form.

Product Specification

Whether you are looking for large quantities of Solder Ribbon in specific widths and thicknesses for automatic die bonding, or a few feet to do testing, Indium Corporation can accommodate your needs. Our capabilities allow us to manufacture widths as small as .020″ (.5mm) and up to 2.25″ (57.15mm). Thicknesses range from .001″ (.025mm) up to as thick as your application requires. All dimensions are dependent on the properties of the metals involved.

Product Description

  • Solder Preforms

    Solder preforms are used in a variety of applications that require precise amounts of solder. Preforms come in standard shapes such as squares, rectangles, washers, and discs. Typical sizes range from .010” (.254mm) up to 2” (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tight tolerances to assure volume accuracy.

    • Packaging Options
      • Waffle Tray, Tape & Reel:
    • Next day delivery in stock items ordered before 4.30pm

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Product Specification

A wide assortment of alloys is available in liquidus temperatures that range from 47°C to 1063°C. Alloys can be indium–contained, gold-contained, lead–free, fusible or standard tin–lead, as well as many others.

  • Alloy selection should be based on strength and other required physical properties, as well as the preferred soldering temperature and the operating temperature of the device being soldered. A general rule is to select an alloy that melts at least 50°C higher than the operational temperature of the part being soldered.
  • Next, consider the materials being soldered and which solder is most compatible with them. For example, tin–based solders will scavenge the gold from gold-plated parts, forming brittle intermetallics, so indium-based solders are generally recommended in these cases.
  • Metals and alloys have different characteristics that can affect the ease with which they can be made into different shapes and thicknesses. It is important to consider the shape of the final preform in the alloy selection process.
  • The operating environment of the completed assembly is also an important consideration for alloy selection. Will it operate in very high or very low temperatures, or be subjected to vibration? If so, an alloy should be selected that will stand up to these conditions. Our Application Engineers will work with you to determine the best alloy for your application.

Product Description

  • Low-Temperature Solder

    Traditional solders have reflow temperatures in the range of 183 to 221°C. However, advancements in components, substrates, and electronics design have driven the need for solder that will reflow in the 115 to 180°C range. Some of these key drivers include:

    • Temperature sensitive components (i.e., plastic-capped MEMS or GaAs sensors)
    • Substrates that deform, melt, or delaminate at higher reflow temperatures (i.e., 3D-MID plastics, fabrics, or flex circuits)
    • Processes that require step-soldering
    • Desire for lower reflow costs
    • Mating parts that have significant difference in their coefficient of thermal expansion (CTE)
    • Pb-free solders that reflow in the range of the traditional SnPb and SnPbAg options Solder alloys in this temperature range are generally indium- or bismuth-based. Some of the more popular solders are shown in the table on the back of this sheet.

    • Packaging Options
      • Paste, Wire, Spheres, Preforms, Ribbon/Foil:
    • Next day delivery in stock items ordered before 4.30pm

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Product Specification

Low-temperature solders are available in similar forms
to traditional solders. Solder paste

  • NC-SMQ®80 for indium-containing
  • Indium5.7LT for bismuth-containing
  • Can be used in all standard stencil, printing, and dispense operations
  • Flux vehicles still need to reach 170 to 180°C for full activation Solid Wire
  • Solid wire diameters starting at 0.010″ (0.254mm)
  • Exacting tolerances
  • Oil-free Spheres
  • Consistently high sphericity
  • Accurate diameters
  • Available in tape & reel Preforms
  • Can be flux-coated
  • Provide a controlled, repeatable solder volume for each insertion
  • Available in custom sizes and thicknesses
  • Packaging for automated and manual processes Ribbon/Foil
  • Custom widths and thicknesses
  • Can be used for initial material evaluations Contact our Application Engineering group for more information on the right alloy and form for your application.

Product Description

  • InForms

    InFORMS® are reinforced matrixed solder composites. This process produces a reinforced solder fabrication with improved strength and creates a more consistent bondline thickness. A uniform bondline maximizes the thermal and mechanical reliability in the solder joint, therefore, producing solder joints that are higher in reliability. InFORMS® can be manufactured into a wide variety of shapes, including rectangles, discs, and custom shapes, to suit specific application requirements. InFORMS® are also available in ribbon* form for automated assembly.

Product Specification

InFORMS® offer dramatically improved handling when compared to conventional solder alloy or indium sheet, foil, ribbon, or large preform materials. InFORMS® also offer increased tensile and compressive strength via the substrate materials while retaining the unique attributes of the outer layer metal (e.g., the softness, ductility, and other advantages of indium).

Product Description

  • Semiconductor-Grade Preforms

    The need for high-temperature solders is growing as RF and power semiconductor devices continue to get smaller, with power density increasing both as a consequence of the shrink and as a result of increased power ratings. Indalloy®182 (80Au/20Sn eutectic solder) has been the workhorse for high-temperature, high-reliability, die-attach applications for many years. However, as junction temperatures (Tj) increase, the gold-tin eutectic solder is beginning to reach its limit of utility. Higher temperatures cause increased thermal fatigue and delamination can also be seen at the solder joints. The next option for RF and power semiconductor manufacturers needing higher temperatures is 88Au/12Ge. The melting temperature of 88Au/12Ge is 356°C (eutectic). The traditional 88Au/12Ge alloy has poor solderability, which manifests as large voids in the bond. Voids are poor conductors of heat which create hot spots, and are the primary cause of premature failures. Indium Corporation developed a semiconductor-grade 88Au/12Ge that increases solderability and decreases voiding%.

    • Packaging Options
      • Waffle Pack, Tape & Reel, Array Tray Pack:
    • Next day delivery in stock items ordered before 4.30pm

      Exclusive UK Partner