Pasta de soldadura sin plomo Indium 8.9HF, tipo SAC305, 4,5

Indium 8.9HF Lead Free Solder Paste SAC305 Type 4 is an air reflow, no-clean solder paste specially designed for the higher processing temperatures required by lead-free alloy systems. This solder paste has a composition of 96.5% tin, 3% silver, and 0.5% copper, delivering reliable soldering results while adhering to industry standards. It is halogen-free, verified by the EN14582 test method, making it an environmentally conscious choice without compromising on quality.

Indium 8.9HF solder paste provides exceptional stencil print transfer efficiency, ensuring high accuracy and consistency in solder deposition. Moreover, Indium 8.9HF minimises hot and cold slump and provides high oxidation resistance, wetting effectively to oxidised BGA and pad surfaces.

In addition to its mechanical properties, the Indium 8.9HF solder paste is designed to enhance in-circuit testing (ICT) by offering high probe testability, significantly reducing the risk of false failures. This makes it an ideal choice for manufacturers looking for increased reliability and process efficiency.

• Lead-free solder paste (96.5Sn/3.0Ag/0.5Cu)
• Halogen-free
• Ideal for high temperature and long reflow soldering processes
• Low BGA, CSP, QFN voiding
• High transfer efficiency through small apertures
• High oxidation resistance
• Backward compatible with SnPb alloys

Storage

In addition to its mechanical properties, the Indium 8.9HF solder paste is designed to enhance in-circuit testing (ICT) by offering high probe testability, significantly reducing the risk of false failures. This makes it an ideal choice for manufacturers looking for increased reliability and process efficiency.