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Indium 8.9HFA Pb Free Solder Paste

Indium8.9HFA is an air reflow, no-clean solder
paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional
Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Manufacturer: Indium


• Eliminates clogged apertures through advanced rheology
• Excellent wetting
• Halogen-free per EN14582 test method
• Eliminates hot and cold slump
• High oxidation resistance
• Excellent soldering performance under high
temperature and long reflow processes


Product Specifications


Metal Load*


Type 3

Type 4

Type 4.5

95.5Sn/3.8Ag/0.7Cu (SAC387)


88.0% -


87.75% -


96.5Sn/3.0Ag/0.5Cu (SAC305)


88.0% -


87.75% -


98.5Sn/1.0Ag/0.5Cu (SAC105)


88.0% -


87.75% -


99Sn/0.3Ag/0.7Cu (SAC0307)


88.0% -


87.75% -


* Application Dependent


Indium Corporation manufactures low-oxide spherical
powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. Type
4 and Type 3 powder are standard offerings with
SAC305 and SAC387 alloys. The metal percent is
the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application. Standard product offerings are detailed in the following table.


Indium8.9HFA is currently available in 500g jars or
600g cartridges. Packaging for enclosed print head systems is also readily available. Alternate packaging options may be available upon request. Storage and Handling


The shelf life of Indium8.9HFA is 6 months. Solder
paste packaged in cartridges should be stored tip down.
Solder paste should be allowed to reach ambient working temperature prior to use. Generally, paste should be removed from refrigeration at least two hours before use. Actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Jars and cartridges should be labeled with date and time of opening.


Test Result

J-STD-004A (IPC-TM-650)

• Flux Type (per J-STD-004A) ROL0

• Flux Induced Corrosion

(Copper Mirror) Type L

• Presence of Halide

Oxygen Bomb followed by

ion chromatography

• SIR Pass

Test Result

J-STD-005 (IPC-TM-650)

• Typical Solder Paste Viscosity 1300 poise

Malcom (10rpm)

• Slump Test Pass

• Solder Ball Test Pass

• Typical Tackiness 35g

• Wetting Test Pass


• SIR Pass

• Electromigration Pass

All information is for reference only. Not to be used as incoming product specifications.


Stencil Design:

Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step
in optimizing the print process. The following are a few general recommendations:
• Discrete components — A 10–20% reduction
of stencil aperture has significantly reduced or
eliminated the occurrence of mid-chip solder beads.
The “home plate” design is a common method for
achieving this reduction.
• Fine pitch components — A surface area reduction is recommended for apertures of 20 mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts.
The amount of reduction necessary is process
dependent (5–15% is common).
• For optimum transfer efficiency and release of the solder paste from the stencil apertures, industry standard aperture and aspect ratios should be adhered to.

Printer Operation:

The following are general recommendations for stencil printer optimization. Adjustments may be necessary based on specific process requirement:
• Solder Paste Bead Size: 20–25mm diameter
• Print Speed: 25–150mm/sec
• Squeegee Pressure: 0.018–0.027kg/mm
of blade length
• Underside Stencil Wipe: Start at once every 5 prints then decrease frequency until an optimum value is determined.
• Solder Paste Stencil Life: >8 hrs. @ 30–60% RH
& 22°–28°C


Indium8.9HFA is designed for no-clean applications,
however the flux can be removed if necessary by
using a commercially available flux residue remover.
Automated stencil cleaning is best performed using a dry wipe followed by a vacuum wipe. If using a
wet wipe, isopropyl alcohol (IPA) or a commercially available solvent-based cleaner should be used. IPA and other solvent-based cleaners are also acceptable for manual stenci cleaning.

Compatible Products

• Rework Flux: TACFlux® 020B, TACFlux® 089HF
• Cored Wire: CW-802, CW-807
• Wave Flux: WF-7745, WF-9945


Heating Stage:

The use of a linear ramp rate or ramp-to-spike (RTS) type profile assists in minimizing the greatest overall number of defects associated with the reflow process. If the ramp rate is too fast, it can cause solder balling, solder beading, and aggravated hot slump, which can lead to bridging. The ramp rate in the preheat stage of the profile can range from 0.5°–2.5°C/second (0.5°–
1°C/second is ideal). A short soak of 20–30 seconds just below the melting point of the solder alloy can help minimize tombstoning when using a RTS type profile.
If necessary, a ramp-soak-spike (RSS) profile can be implemented to minimize voiding on BGA and CSP type packages. A soak zone between 200°–210°C for up to 2 minutes is acceptable.

Liquidus Stage:

To achieve acceptable wetting and form a quality solder joint, the acceptable temperature range above the melting point of the solder alloy is 12°–50°C (15°–
30°C is ideal). The acceptable range for time above liquidus (TAL) is 30–100 seconds (45–60 seconds is ideal). A peak temperature and TAL above these
recommendations can result in excessive intermetallic formation that can decrease solder joint reliability. Cooling Stage:
A rapid cool down is desired to form a fine grain structure. Slow cooling will form a large grain structure, which typically exhibits poor fatigue resistance. The acceptable cooling range is
0.5°C–6.0°C/second (2.0°–6.0°C/second is ideal).

This product data sheet is provided for general information only. It is not intended, and shall not be construed, to warrant or guarantee the performance of the products described which are sold subject exclusively to written warranties and limitations thereon included in product packaging and invoices. All Indium Corporation’s products and solutions are designed to be commercially available unless specifically stated otherwise.




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WD18 9DA

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