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Indium NC-SMQ80 Solder Paste

NC-SMQ®80 is a halide-free, no-clean solder paste formulated for use with indium-based alloys. Indium-containing alloys of fer the benefits of reduced leaching/scavenging of metallizations of precious metals like gold or silver, and improved ductility to compensate for coefficient of thermal expansion (CTE) mismatches between dissimilar materials. NC-SMQ80 is a medium residue, air-reflow paste with exceptional wetting capabilities. NC-SMQ80 meets or surpasses all ANSI/J-STD-004, -005 and Bellcore test criteria.
Manufacturer: Indium
Description

Features

• Formulated for use with indium-based alloys
• No-clean residue
• Exceptional wetting in air reflow
• Reduces leaching/scavenging of precious metals
• Halide-free

Introduction

NC-SMQ®80 is a halide-free, no-clean solder paste formulated for use with indium-based alloys. Indium-containing alloys of fer the benefits of reduced leaching/scavenging of metallizations of precious metals like gold or silver, and improved ductility to compensate for coefficient of thermal expansion (CTE) mismatches between dissimilar materials. NC-SMQ80 is a medium residue, air-reflow paste with exceptional wetting capabilities. NC-SMQ80 meets or surpasses all ANSI/J-STD-004, -005 and Bellcore test criteria.

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of Sn/In/Ag and numerous indium-based alloys in the industr y standard type 3 mesh size (J-STD-006). Other non-standard mesh sizes are available upon request. The weight ratio of the flux/vehicle to the solder powder is referred to as the metal load and is typically in the range of 83-92% for standard alloy compositions.

Standard Product Specifications

Alloy

Metal Load

Mesh Size

Particle Size

 

Printing

Dispensing

Type 3

25-45 µ

#1E (In52/Sn48)

89%

84%

-325/+500

0.001-0.0018”

#205 (In60/Pb40)

89%

84%

-325/+500

0.001-0.0018”

#227 (Sn77.2/In20/Ag2.8)

89%

84%

-325/+500

0.001-0.0018”

Packaging Standard

Packaging for stencil printing applications includes 4oz. jars and 6oz. or 12oz. car tridges. For dispensing applications, 10cc and 30cc syringes are standard. Other packaging options are available on request.

Storage and Handling Procedures

Refrigerated storage will prolong the shelf life of solder paste. The shelf life of NC-SMQ80 is 6 months at storage temperatures of -20° to +5°C. Storage temperatures should not exceed 25°C. When storing solder paste contained in syringes and car tridges, they should be stored tip down.
Solder paste should be allowed to reach ambient working temperature prior to use. Generally, paste should be removed from refrigeration at least two hours before use. Actual time to reach thermal equilibrium will var y with container size. Paste temperature should be verified before use. Jars and car tridges should be labeled with date and time of opening.

Material Safety Data Sheets

The MSDS for this product can be found online at http://www.indium.com/techlibrar y/msds.php

BELLCORE AND J-STD TESTS & RESU LTS

Test

Result

Test

Result

J-STD-004 (IPC-TM-650)

 

J-STD-005 (IPC-TM-650)

 

Flux Type Classification

Flux Induced Corrosion

ROL0

• Typical Solder Paste Viscosity

(#205, 89%, -325/+500)

950 Kcps

(Copper Mirror)

Presence of Halide

Silver chromate

Pass

Pass

(#227, 89%, -325/+500)

Brookfield (5 rpm),

• Typical Thixotropic Index

900 Kcps

-0.69

Fluoride Spot Test

Pass

(ICA Test) (#205)

 

Post Reflow Flux Residue

(ICA Test)

45%

• Slump Test

• Solder Ball Test

Pass

Pass

Corrosion

• SIR

• Bellcore Electromigration

Pass

Pass

Pass

• Typical Tackiness (#205)

• Wetting Test

33g

Pass

• Acid Value

107

   

All information is for reference only. Not to be used as incoming product specifications.

Printing

Stencil Design:

Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aper ture design is a crucial step in optimizing the print process. The following are a few general recommendations:
• Discrete components — A 10-20% reduction of stencil aper ture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction.
• Fine-pitch components — A sur face area reduction is recommended for aper tures of 20 mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shor ts. The amount of reduction necessar y is process dependent (5-15% is common).
• For adequate release of solder paste from stencil aperatures, a minimum aspect ratio of 1.5 is suggested. The aspect ratio is defined as the width of the aper ture divided by the thickness of the stencil.

Printer Operation:

The following are general recommendations for stencil printer optimization. Adjustments may be necessar y based on specific process requirements:
• Solder Paste Bead Size: 20-25mm diameter
• Print Speed: 12.5-50mm sec
• Squeegee Pressure: 0.018-0.027kg/mm of blade length
• Underside Stencil Wipe: Once ever y 10-25 prints
• Solder Paste Stencil Life: >6 hrs. 30-60% R.H. &22-28°C

Cleaning

NC-SMQ80 is designed for no-clean applications. However, the flux can be removed if necessar y by using a commercially available flux residue remover.
Stencil Cleaning: This is best-per formed using an automated stencil cleaning system for both stencil and misprint cleaning to prevent extraneous solder balls. Most commercially available stencil cleaning formula- tions including isopropyl alcohol (IPA) work well.

Compatible Products

• Rework Flux: TACFlux 012

Reflow

Recommended Profile:

This profile is designed for use with Indalloy #205 (60In/40Pb) MP 181°C and #227 (77.2Sn/20In/2.8Ag) MP 187°C. It will serve as a general guideline in establishing a reflow profile for your process. Adjustments to this profile may be necessary based on specific process requirements and the use of alloys with different melting temperatures.

Heating Stage:

A linear ramp rate of 0.5°-2.0°C/second allows gradual evaporation of volatile flux constituents and prevents defects such as solder balling/beading and bridging as a result of hot slump. It also prevents unnecessar y depletion of fluxing capacity when using higher temperature alloys. A profile with an extended soak above 150°C can be implemented to reduce void formation and minimize tombstoning when required.

Liquidus Stage:

A peak temperature of 25°-45°C (215°C shown) above the melting point of the solder alloy is needed to form a quality solder joint and achieve acceptable wetting due to the formation of an intermetallic layer. If the peak temperature is excessive, or the time above liquidus greater than the recommended 30-90 seconds, flux charring, excessive intermetallic formation and damage to the board and components can occur.

Cooling Stage:

A rapid cool down of <4°C/second is desired to form a fine grain structure. Slow cooling will form a large grain structure, which typically exhibit poor fatigue resistance.

If excessive cooling >4°C/second is used, both the components and the solder joint can be stressed due to a high CTE mismatch.

This product data sheet is provided for general information only. It is not intended, described which are sold subject exclusively to written warranties and limitations and shall not be construed, to warrant or guarantee the performance of the products thereon included in product packaging and invoices.

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