LOCTITE ABLESTIK CE 3104WXL

Loctite ABLESTIK CE 3104WXL Electrically Conductive Epoxy is a silver-filled, electrically conductive epoxy adhesive engineered for high-performance electronic assembly and semiconductor packaging applications. Designed as a lead-free alternative to solder, this material delivers reliable electrical conductivity alongside strong mechanical bonding performance.

The formulation uses tightly controlled silver particle sizing to enable ultra-fine resolution printing, making it suitable for stencil or screen printing processes. This allows precise adhesive deposition in fine-pitch patterns without bridging, even on dense circuit layouts.

CE 3104WXL is heat-curing and optimised for SMD component attachment, offering stable electrical performance and consistent bond integrity across a range of substrates including silver, tin/lead finishes, and OSP-coated copper.

Key Features

• Electrically conductive silver-filled epoxy
• Lead-free alternative to traditional solder
• Stencil and screen printable formulation
• Controlled particle size for fine-pitch resolution
• Low cure temperature capability
• Reliable conductivity and bond strength

Typical Applications

• SMD component attachment
• Semiconductor and microelectronics assembly
• Electrically conductive bonding
• Hybrid circuit manufacturing
• Aerospace and defence electronics

Loctite ABLESTIK CE 3104WXL is widely used in high-reliability electronics manufacturing environments where controlled conductivity, precision deposition, and lead-free compliance are essential.