BERGQUIST GAP FILLER TGF 1400SL is a two component, silicone based, thermally conductive liquid gap filler. Low viscosity of the material enables self leveling and filling of unique and intricate gaps resulting in excellent thermal transfer and vibration dampening. This product can be used with infinite thickness variations and for fragile assemblies with less or no stress to the components. It is curable at room temperature, however, the cure rate can also be accelerated with application of heat.
- Low viscosity, deep penetration
- Thermal conductivity: 1.4 W/m-K
- Vibration dampening
- Self-leveling
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